Silicon Integration

 Capabilities

Utilizing our state of the art high speed placement equipment capable of placing over 100,000 components per hour, we are capable assembling SMT and mixed technology production runs of up to three million components.

Technology

  • Plastic, Ceramic and Micro BGA / Flip-Chip / CSP

  • BGA Rework / BGA Reballing

  • BGA and QFP sockets

  • Ultra Fine Pitch QFPs with 12 mil pitch

  • 0201 SMT Devices

  • Facility designed to accommodate boards up to 18" x 20"

  • Paperless documentation

  • MRP material management

Featuring

  • High tech, high density, printed circuit assembly

  • Large and Unusual Form Factor Boards

  • Fully automated high speed SMD assembly

  • Turn-Key / Quick-Turn Prototyping

  • RF assembly and test expertise

  • Complex, electro-mechanical integration

  • Systems assembly and test skills

  • Water soluble and no-clean soldering

Equipment

  • Fuji

  • Universal

  • Mydata

  • Speedline (MPM)

  • Heller

  • ABW

  • Vitronics Soltec

  • Electrovert

  • YESTECH AOI

  • High resolution real-time X-Ray

  • Metcal

  • Automated lead forming and cutting of Thru-hole components

  • REsys De-Ionized Water System

  • Moisture bake-out Oven

  • Oscilloscopes, Spectrum Analyzers, Logic Analyzers, Function Generators, etc.
 
 
 

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